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IL0-786 Designing Flexible Wireless LAN Solutions

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IL0-786 exam Dumps Source : Designing Flexible Wireless LAN Solutions

Test Code : IL0-786
Test Name : Designing Flexible Wireless LAN Solutions
Vendor Name : Intel
: 73 Real Questions

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Intel Designing Flexible Wireless LAN

Intel Unveils Compute Card, a credit card-Sized Compute Platform | Real Questions and Pass4sure dumps

compute-card-2x1today, Intel is announcing a brand new modular compute platform called the Intel® Compute Card together with a variety of partners who should be working with Intel to assist accelerate the ecosystem of solutions based on the Intel Compute Card. Intel has been a leader in offering expertise to support realize the benefits of the information superhighway of issues and permit more wise and connected gadgets. The Intel Compute Card is being developed with that in mind, to transform the way compute and connectivity can also be built-in and utilized in future contraptions.

The Intel Compute Card has all the facets of a full desktop, including Intel SoC, memory, storage and instant connectivity with flexible I/O options so hardware producers can optimize for their certain options – from interactive fridges and smart kiosks to safety cameras and IoT gateways. gadget makers without difficulty design a typical Intel Compute Card slot into their equipment after which utilize the ideal Intel Compute Card for their efficiency and price needs. This reduces the time and components vital to design and validate the compute block and helps speed up innovation to deliver the vigor of intelligence into an ever wider range of devices.

reality sheet: Newly introduced Intel® Compute Card, a bank card-Sized Compute Platform

Intel is working with a wide range of companions who share their imaginative and prescient that the Intel Compute Card might enormously trade the style they and the relaxation of the business design and productize a wide range of options in the near future. These companions are working to boost products that may take expertise of the simplified design, ease of serviceability and user upgradeability of the Intel Compute Card. Intel is proud to be working with leading world partners, together with Dell*, HP*, Lenovo* and Sharp*, to bring this vision to fact. additionally, Intel is working with a variety of regional companions who are all trying to carry unique options to their respective markets. These early companions encompass Seneca information*, InFocus*, Contec DTx*, TabletKiosk* and Pasuntech*.

The Intel Compute Card could be purchasable in mid-2017 and may come with various processors alternate options, together with the latest seventh Gen Intel® Core™ processors. For more assistance and to live up to date on the Intel Compute Card, visit

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Why Intel believes 5G wireless will make independent cars smarter | Real Questions and Pass4sure dumps

The cyber web of things is expected to develop at once to tens of billions of linked instruments, from smart refrigerators to wise showers to sensible cruise ships. fairly quickly, it’s going to lengthen to smart cars, as Intel confirmed at its contemporary autonomous automobiles adventure in San Jose, Calif.

however Intel is aware of that we’ll must get records in and out of those automobiles at charges that are an awful lot sooner than today’s LTE mobile networks can tackle. And that’s why Rob Topol, widespread supervisor of Intel’s 5G enterprise and know-how, believes that 5G wireless networking could be just like the “oxygen” for self-riding automobiles.

Intel is making 5G modem chips to transfer records at gigabits a second over instant networks sooner or later, possibly as early as 2020. Topol believes this instant networking will enable self-riding cars to talk with related infrastructure. That infrastructure will support the automobiles procedure sensor, safeguard, and other suggestions for the car and return the outcomes instantly to the vehicles.

“What they have been showing with that demonstration is a capacity called V-to-X — car to infrastructure, car to pedestrian, or car to vehicle,” Topol talked about. “You’re utilising the different objects and the usage of a network to supply the car vision past issues it could actually’t see in the course of the mechanisms within the motor vehicle itself — whatever that’s going on around the corner or extra ahead.”

We mentioned 5G and its connection to autonomous driving in a contemporary interview. right here’s an edited transcript of their talk.

Above: Rob Topol, well-known manager of the 5G enterprise at Intel.

photograph credit score: Dean Takahashi

VB: the place are they on the timeline for 5G?

Rob Topol: As you’ve seen, there’s been lot of work occurring in 5G over about the last yr and a half. It began with establishing the air interface, the way it works between the machine and the core entry network. It begins with the trial necessities we’ve been doing, the place you are attempting out different things like modulation or channel coding, almost building this new radio.

The timeline is that you just do lots of those trial necessities over a couple of yr to two years. All that work you do within the box, trying out with companions and constructing a recipe, you take them to the standards their bodies and post them as contributions. Intel and other groups will put up their concepts and say, “this is what they consider the average should still be in line with.” The vote casting happens in 3GPP from a mobile standpoint, with the first circular later this yr. In December, the brand new Radio, or NR specification, will be set, and the entire free up for 5G occurs in Q3 of 2018.

as soon as the NR spec is decided, that’s if you’ll delivery to see construction across the modems, across the networking machine to aid that. Full unlock 15 is at greenlight. That’s if you happen to see the Capex orders come in from network operators to the infrastructure organizations. Intel puts its chipset designs into production. You start to look some operators roll out networks as early as 2019. You’ll probably see most do them round 2020. usually, as soon as the total unencumber is performed, it’s about 18 months except you delivery to look the networks deployed in a broader manner.

VB: How do you help individuals get an appreciation for a way vital here's? What’s at stake? what will people get out of it?

Topol: They focus on the issues that 5G is about that 4G turned into not, if that makes sense. 4G turned into the era of the smartphone — statistics proliferation, access to media, mobility in widely wide-spread, with anything to your pocket. 5G is an period past the smartphone. Over the subsequent five to 10 years, they have billions of linked issues arising throughout us. As they make everything from a refrigerator to a car to a house to an business community smarter, the compute that’s going on—extra information is shipped via a network, no matter if to assist increase the provider mannequin or the person event of those issues, or to reap that facts for machine getting to know and records analytics, any kind of habits or artificial intelligence work.

We study 5G as the platform that helps all of these different verticals develop. They see one of the early use case analysis. They see a lot of promise for 5G in car. They see a lot of promise for wise domestic and enterprise, if you move networks more to a set instant capability. now not just counting on fiber and different LAN connections. We’re additionally industrial automation. they have a couple of projects in that space, assisting get a lot of that incubation going. What does a linked manufacturing facility imply? How does it operate? How would a manufacturing unit benefit in productiveness, within the method machines are install and run and optimized, when the factory is linked? What ability does that deliver?

How do they aid americans with that vision? They exhibit as lots of these use situations as early as they can. They exit and showcase with automobile companies, displaying them 5G in a vehicle, so they can see the way records comes into the automobile for the manner it functions, for defense, and extra important for bandwidth, the way their experience inner the automobile goes to exchange when it’s self reliant. if you happen to’re sitting within the back seat of that motor vehicle, your journey alterations. You’re not required to be absolutely concentrated on the place it’s going and what it’s doing. The bandwidth necessities in the vehicle are going to develop exponentially as their time is freed up inner the car.

We do the identical factor in industrial automation. They deploy a partnership with GE and Honeywell and Ericsson called the 5G Innovators Initiative. We’re blueprinting what they feel the manufacturing facility of the future might and may seem like, how it would operate. They are trying to give people that vision. We’ll do this for the way drones are used. We’ll do it for mounted instant in home and commercial enterprise. We’ll do it for media and viewing adventure. We’re working with media corporations to look on the way media is captured and how it’s transmitted and the way it’s consumed. That’s one more essential center of attention area of that initiative.

Above: Intel is relocating quick into independent vehicles.

photo credit score: Intel

VB: I’ve seen different sorts of studies about how huge 5G goes to be as a contributor to the global economic climate. What do you feel about that? is that this going to transform society?

Topol: It opens new enterprise fashions. As you talk about a smarter metropolis, or a more productive manufacturing facility, or a car that may run autonomously, it does trade their behaviors, their habits, and what they will do with their time. I’d agree that 5G will open up many new enterprise opportunities, basically on account of the data that’s coming off these wise and related machines throughout us. The ability to research, compute, and harvest that facts is going to make us smarter in the manner they lay out cities, deploy factories, drive cars, and do other things around us.

There’s an immense chance. I don’t have a specific analyze we’ve achieved yet. Their focus is to bring the technology baseline and the use circumstances round it. We’re confident that their partners are going to construct amazing company fashions around it.

Our approach from the start, as they said at CES, is conclusion-to-end potential. Intel is the most effective company that sells hardware options from the gadget all the approach up in the course of the core and entry networks and into the cloud and information core. Their means to construct out that new vertical for a accomplice – to sit down with GE or Honeywell or a media enterprise and exhibit how that blueprint works in 5G – is a very compelling case for Intel. they are able to do very quick checking out and prototyping and stream to industrial options. That’s a part of why they have the companions coming in and dealing with us that they do. It’s a large a part of their strategy.

Above: Intel and Ericsson obtain first pre-5G over-the-air instant interoperability between the 5G Intel mobile Trial Platform UE and the Ericsson 5G Radio Prototype system.

picture credit: Intel

VB: They talked before about how, in many ways, 5G and the bandwidth it brings may allow a shift in where computing occurs. if you need it to take place within the cloud, it could actually take place there, or it could turn up at the edge. however then the expansion of demand for that selected bandwidth, at the least within the case of 4G, led to the networks to hamper once more. once everyone became capable of watch video on their smartphones, they did it, and that introduced down the best of voice traffic on the networks.

Topol: precisely. There are two or 3 ways they need to address and mitigate that. the primary is to have a strong advocacy place round spectrum. There’s extra spectrum available for use for these communication types. Opening up more spectrum in the lessen frequencies, beneath 6Ghz, but also opening up—a lot of the prototyping we’re doing in millimeter-wave is to open up that additional bandwidth by means of spectrum allocation. We’re amazing advocates of that globally. They drive, through most of the advocacy companies, that harmonization, attempting to have certain materials of millimeter-wave, definite spectrum in sub-6Ghz, be harmonized globally. It’s simpler, from a design standpoint, for their radios, and it’s also simply a much better adventure for patrons to transcend between these places.

The 2d is offloading what's definitely going up through the networks. They talked a bit final time about computer to machine communication. a large a part of 5G protocol isn't most effective to make a fatter pipe and higher broadband connection, but to permit more computer to laptop communique, where those machines don’t should speak up via that native access point or base station. they can talk directly with each different. That’s a big offload for those networks.

The third is some of the community transformation applied sciences that Intel is pioneering. One is mobile edge compute, where it’s inserting greater of the caching and content material at the edge of the network. It’s no longer anything that has to move all the method lower back via an access community and into the cloud to access and retrieve that. lots of content can also be carried nearer on the fringe of the community.

an extra one is network chopping. With 5G, in the event you stream to a utility-described community, which you can slice the enterprise mannequin or the vertical. With automotive, that you could slice the way the vehicles connect with base stations and mobilephone towers and up during the network. which you can almost quarantine it from riding by using a busy school campus with tons of of school youngsters streaming and downloading media, or another actions that constrain a network. You don’t need that to affect the defense performance of automobiles, or the reliability a related manufacturing facility might want. network cutting is fairly essential.

think of it as spectrum allocation, having these community transformation technologies, in addition to offloading a lot of conversation and conserving it at a native, desktop to desktop level.

Exploring Intel's H370, B360, and H310 chipsets | Real Questions and Pass4sure dumps

Intel's coffee Lake CPUs have been with us because October of remaining 12 months, and that they put the blue team back on a competitive footing after AMD's Ryzen onslaught of multithreaded bang-for-the-buck. today, Intel unveiled a number of new desktop and cellular CPUs that fill out lots of its eighth-generation processor lineup, including several new locked laptop parts.

Intel's locked Core i5-8400

New chips with extra cores are just one ingredient in a competitive recipe, even though. Intel has so far required the use of its unlocked Z370 motherboards with each espresso Lake CPU, whether those chips had been multiplier-locked or multiplier-unlocked. For finances builders who wanted a cup of coffee Lake, that fact compelled them to pair pretty within your budget and multiplier-locked Core i3-8100 and Core i5-8400 CPUs with costly motherboards designed for overclocking the excellent-end Core i5-8600K and Core i7-8700K. In distinction, AMD's Ryzen CPUs have long enjoyed a full range of suitable AM4 motherboards, from low-cost A320 fashions to mainstream enthusiast B350 boards and on to the latitude-topping X370 chipset. Builders of every stripe may find an AMD motherboard to go together with their budget generally from the get-go.

along with their sensibly-priced companion motherboards, AMD's Ryzen 3 and Ryzen 5 CPUs may still declare aggressive performance in a wide enough range of projects that it became frequently price pocketing the mark downs from building with AMD and inserting the additional money towards different accessories in a equipment. That capabilities became principally stark currently with the arrival of AMD's enviably balanced Ryzen three 2200G and Ryzen 5 2400G, whose compelling entry-degree gaming performance and low-cost mobos left Intel's Core i3-8100 and Core i5-8400 looking somewhat high-and-dry for individuals trying to build do-it-all finances and midrange methods.

H370 platform block diagram courtesy Gigabyte

today, Intel is extending a hand to price range builders eyeing its locked-down chips with motherboards built across the new H370, B360, and H310 chipsets. Motherboards constructed with these platform controller hubs (PCHs) on board should still go a long means towards cutting back the platform can charge associated with coffee Lake. by means of forgoing the skill to overclock CPUs or RAM, they give extra brilliant foundations for methods developed round locked Intel eighth-technology processors.

The H370 PCH. supply: Intel

in contrast to Z370 before it, the silicon that underpins these new products really brings a couple of new hints to the desk. For one, the silicon that underlies H370 is the primary Intel PCH to offer native, baked-in USB 3.1 Gen 2 aid. That truth capacity motherboard makers now not should rely on third-celebration USB 3.1 Gen 2 controllers from sources like ASMedia to deliver excessive-speed peripheral connectivity to their boards' lower back panels. As a refresher, USB 3.1 Gen 2-appropriate peripherals can switch records at up to 10 Gb/s.

source: Intel

The different essential alternate in H370 (and B360 and H310) boards regards wireless networking help. historically, Intel instant adapters built-in controller and radio-frequency facets into a single module that slotted into a common M.2 E-key slot. To get instant networking on board, companies could design their motherboards with committed M.2 slots for Wi-Fi modules or depart it to builders so as to add PCIe or USB Wi-Fi radios to average historical PCIe slots. H370, nonetheless, is the first mainstream desktop chipset to make use of Intel's built-in Connectivity, or CNVi, expertise for instant networking.

CNVi strikes the logical or control services of Intel instant modules into the platform controller hub itself. With CNVi, manufacturers best need to add a appropriate associate RF (or CRF) module to their motherboards to allow wireless networking support. as a minimum with the Gigabyte H370 motherboard they have handy, CNVi is never a lock-out for different M.2 Wi-Fi modules, either. an easy BIOS change tells the board no matter if to seek a CNVi-suitable CRF module or a regular old M.2 E-key Wi-Fi card.

The wireless-AC 9560 module. supply: Intel

The highest-conclusion Intel instant-AC 9560 associate RF module delivery aboard Gigabyte's H370 and B360 boards with Wi-Fi enabled supports what Intel and its partners are calling "Gigabit Wi-Fi," courtesy of 802.11ac Wave 2 aspects like a hundred and sixty MHz channel widths and MU-MIMO. Intel claims speeds as high as 1.73 Gbps from the instant-AC 9560, though that speed will probably choke on the Gigabit Ethernet wired links that are average of most domestic networks these days. it be value noting that those speeds will most effective seem in tandem with appropriate 802.11ac Wave 2 networking equipment, too. The instant-AC 9560 CRF also supports Bluetooth 5.0. Intel claims the subsequent-gen Bluetooth spec has superior range, potentially higher speed, enhanced broadcast ability for connectionless IoT environments, and simpler pairing compared to Bluetooth 4.x, although they would predict—again—that appropriate hardware should be required to take capabilities. lessen-end associate RF modules just like the wireless-AC 9462 and instant-AC 9461 nevertheless guide Bluetooth 5.0, but they won't assist MU-MIMO or the maximum 802.11ac Wave 2 speeds.

feature table courtesy Gigabyte

past the loss of overclocking support, H370 motherboards don't quit a good deal to Z370 models through evaluation. The simplest different notable difference between H370 and Z370 is that only the overclocking-friendly chipset will aid CPU PCIe lane bifurcation for Crossfire and SLI configurations. Given the lowering utility of multi-GPU configurations, they doubt finances builders will pass over the ability to pair up GeForces and Radeons.

each of Intel's appropriate-conclusion platforms get 30 high-speed I/O lanes (or flex I/O lanes) to spread around. Z370 boards can dedicate as much as 24 of those lanes to PCIe three.0 slots, although, whereas H370 will most effective be able to commit 20 such lanes to PCIe 3.0 slots. H370 and Z370 boards alike can simplest host a maximum of six SATA ports from the chipset, though third-birthday party controllers might bolster that number. Like Z370 boards, H370 mobos will assist SATA RAID 0, RAID 1, RAID 5, and RAID 10 through Intel's rapid Storage know-how. only Z370 boards may be able to RAID PCIe storage devices attached to the CPU, youngsters (a new characteristic that is rolling out to some Z370 boards as they speak).

B360 and H310 put coffee Lake close by of every builderH370 is never the end of the story for funds Intel eighth-gen-able chipsets launching today, although. The B360 and H310 chipsets will give each potential builder who wants to step as much as an eighth-gen CPU a way onto Intel platforms. those chipsets will both help Intel's CNVi know-how to force appropriate companion RF modules, but their capabilities diverge from there.

in comparison to H370, the B360 chipset can simplest offer as many as 12 USB ports, and simplest six of those may also be USB three.0. Like H370, B360 boards can present as many as four USB three.1 Gen 2 ports from their chipsets as H370 boards. B360 only gives mobo manufacturers 24 high-pace I/O lanes to route, of which most effective 12 will also be used as chipset PCIe 3.0 lanes. B360 boards will also lose the potential to RAID SATA devices in any kind with out an add-on controller of some form, but they may nonetheless help Intel's Optane reminiscence devices for difficult-force caching.

With those capabilities, B360 boards will possible serve smartly for builders who are not looking for tons of growth slots or bells and whistles like PCIe RAID aid (or any kind of RAID assist). at the equal time, B360 continues beneficial features like Optane memory and USB 3.1 Gen 2 aid, may still producers decide to put in force it. B360 appears like the cost favourite for entry-level eighth-gen systems.

The H310 chipset imposes additional limits on PCs built with an eighth-generation Intel CPU. H310 will most effective aid one DIMM per memory channel (for 2 DIMMs in complete) from this type of CPU. It won't assist Intel's Optane memory modules for difficult-pressure caching. it's going to most effective present 14 high-velocity I/O lanes from the chipset. it may possibly simplest be tapped for 10 USB ports, of which simply four may also be USB 3.0 ports.

H310 additionally drops USB three.1 Gen 2 guide entirely. it might simplest provide 4 SATA ports, and it may well handiest offer six PCIe 3.0 lanes from the chipset. With these barriers, it's doubtless that H310 motherboards will vigor most effective the most fundamental of methods and serve as the cut price-basement offering on retailer cabinets. be cautious that H310's limitations give you ample respiration room when planning an eighth-gen Intel pc.

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Designing Flexible Wireless LAN Solutions

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Simplify the Industry 4.0 Design Process with Sitara Processors | real questions and Pass4sure dumps

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Industry 4.0 represents the next generation of manufacturing technology in which cyber-physical systems (CPSs) integrate computation, networking, and physical processes into a seamless whole. They connect to each other and to the cloud; are easily configured; and incorporate sensors and analytics to make functionally safe, more autonomous systems.

Some basic design principles are associated with the Industry 4.0:

  • Interoperability: Machines, devices, sensors and people connecting and communicating with each other through the Internet of Things (IoT).
  • Information transparency: Data gathered by sensors at the machine level, aggregated, then passed upstream to higher levels that allow for unprecedented analysis and insight into factory operations. Place decision-making authority where it has the greatest effect.
  • Human-machine interaction: Support human operators and managers by clearly presenting information for better decision-making and problem-solving. Improve efficiency and quality by supplanting and reducing human action where appropriate.
  • Decentralized decisions: Perform tasks as autonomously as possible.
  • Expected benefits from Industry 4.0 include increased production, improved operational efficiency, reduced energy consumption, increased security, and new business opportunities.

    Achieving these goals impose requirements on designers at all levels—from the system architecture down to the individual device. Designers have been tackling some requirements, such as the need for robust security, for a long time. Functional safety is a more recent mandate that recognizes the increasing complexity of industrial operations.

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    Industry 4.0 Requirements: Deterministic, Synchronized Communication

    Unless it’s a ground-up design, the Industry 4.0 network architecture must be able to support multiple protocols and cover both current and legacy fieldbus standards. Fieldbus is the generic name of a set of industrial network protocols defined in IEC 61158. Although many fieldbus protocols exist, some version of Ethernet is gradually dominating factory networked communication.

    Standard Ethernet in commercial applications has many advantages. It’s cost-effective, with a common physical layer and high-speed operation. The protocol supports a flexible network topology and a flexible number of nodes.

    However, standard Ethernet is non-deterministic. The delay between a message leaving its origin and arriving at its destination varies from one message to the next and can be up to 100 ms. A deterministic network—one without random variations in propagation times between messages—is important for automated and synchronized applications. As a result, factory operations rely on industrial Ethernet protocols that include varying degrees of deterministic data delivery, such as EtherCAT, PROFINET, and Ethernet/IP.

    In addition to deterministic operation, industrial real-time control applications require guaranteed latency; time-sensitive networking (TSN) adds this real-time functionality to standard Ethernet. TSN is an Ethernet extension aimed at addressing determinism and quality of service without compromising the strengths of Ethernet, such as interoperability. Read more about TSN here.

    Industry 4.0 Requirements: Robust Security

    With a signal chain that extends from the individual device to the cloud and includes both wired and wireless components, robust security is essential in an Industry 4.0 application. System designers must conduct a thorough risk evaluation and select appropriate solutions that protect data privacy and resist unauthorized access, while still providing the proper functionality and services.

    As illustrated in Figure 1, a secure embedded design has multiple layers. These features can be grouped into 12 categories—security enablers—to identify the security features that are pertinent to a particular application. Most TI microcontrollers (MCUs), processors, and wireless connectivity devices provide security enablers to help designers build security features into their applications.

    1. An embedded processor requires multiple layers of security. (Source: TI: “Building your application with security in mind: Guide to embedded security” PDF)

    TI has authored a guide to embedded security that discusses each element in more detail.

    Industry 4.0 Requirements: Functional Safety

    The definition of functional safety goes beyond the traditional assumption of the equipment operating correctly in response to its inputs. It includes the “safe management of likely operator errors, hardware and software failures, and environmental failures,” according to German safety agency TUV.

    Functional safety concepts have been adopted in numerous fields, including automotive and rail transportation, industrial processes, medical equipment, and aviation. Figure 2 shows some of the applicable standards.

    2. A variety of specifications define functionally safe operation in different industries. (Source: TI “The state of functional safety in Industry 4.0” PDF)

    Clearly, not every failure has a disastrous result. In industrial operations, IEC 61508 measures the confidence of safety implementation in a system via safety integrity levels (SILs), which indicate the relative level of risk reduction provided by a safety function.

    There are four levels defined by the standard, ranked as SIL-1 to SIL-4 (lowest to highest). Smart factory systems typically conform to SIL-2 or SIL-3. Systems with potentially catastrophic, large-scale failure consequences (such as nuclear reactors) conform to SIL-4. Figure 3 shows the IEC61508 functional safety standards.

    3. An Industry 4.0 design must meet IEC61508 SIL-2 or SIL-3 standards. (Source: TI “Designing industrial control for Industry 4.0 with Sitara AM6x processors” PDF, p. 8)

    To meet these standards, a product manufacturer must design hardware and software that doesn’t pose an unacceptable risk if it malfunctions. The product must include features such as redundancy, diversity, internal self-testing, etc., that increase its robustness against both random and systematic failures.

    Sitara AM6x—Designed for Industry 4.0

    The Sitara family of microcontrollers from Texas Instruments is designed for industrial applications. It’s a scalable portfolio of single-chip solutions based around Arm Cortex-A cores and co-processors with flexible peripherals for real-time communications, as well as optional graphics accelerators and display functions for user interfaces. Sitara also includes software support for popular fieldbuses such as EtherCAT, Ethernet/IP and PROFINET.

    4. The Sitara family accommodates a range of industrial applications. (Source: TI Sitara Processors Overview)

    Figure 4 provides an overview of the Sitara processor portfolio. Sitara devices are optimized for a range of applications, but the high-end AM6x is designed specifically for Industry 4.0. Depending on the model, the five AM6x family members feature:

  • Dual or quad Cortex-A53 cores running at up to 1.1 GHz
  • A microcontroller subsystem (MCUSS) with two Cortex-R5F cores designed for real-time and safety-critical applications
  • Up to 3X Programmable Realtime Unit – Industrial Communication Subsystem (PRU-ICSS) blocks with gigabit capability. PRU-ICSS is a specialized co-processor for interfacing to industrial communication networks.
  • Security enabler: cryptographic acceleration, device identity, secure boot, debug security, external memory protection, trusted execution environment, networking security, secure storage, software IP protection, initial secure programming, secure FW and SW update
  • 3D graphics accelerator
  • Camera interfaces: MIPI, CSI-2, parallel interface
  • Error-correcting-code (ECC) memory
  • Support for many industrial protocols: TSN, EtherCAT, EtherNet/IP, HSR, PRP, POWERLINK, PROFIBUS, PROFINET RT/IRT, Sercos III
  • Figure 5 shows the block diagram of the Sitara AM6x. The part includes features that support the specialized Industry 4.0 requirements discussed above.

    5. The Sitara AM6x is a complex SoC device with support for Industry 4.0 functions. (Source: TI “Designing industrial control for Industry 4.0 with Sitara AM6x processors” PDF, p. 3)

    Functional Safety

    The AM6x architecture integrates features to help designers meet functional-safety requirements up to IEC61508 SIL-3 for industrial control applications.

    For example, the AM6x processor includes Cortex-R5F MCU technology from the TI Hercules product family. For functional safety-enabled AM6x devices, the Cortex-R5F can be configured to run in lock-step mode instead of dual-core mode. The MCUSS can be isolated by internal SPI interfaces to create a chip-within-a-chip architecture for freedom from interference just as if the safety MCU was external to the SoC.

    Designing a functionally safe system requires adherence to a rigorous set of guidelines, for example:

  • The AM6x hardware and software follow independently certified development processes, including requirements for tracking, documentation, and validation.
  • TI provides a software-compliance package and compiler qualification kit to manage systematic failures.
  • TI also provides a configurable “failure mode effects and diagnostics analysis” (FMEDA) tool for the AM6x. This details random failure modes and metrics from the device design, plus diagnostic coverage.
  • The SafeTI-61508 functional-safety package includes a safety analysis report—a certification summary from a third-party assessment of the AM6x as a safety element out of context (SEooC).
  • The AM6x Safety Manual details the hardware, software, and combined hardware/software diagnostics available with the AM6x processor.
  • Security

    The AM8x manages security via its device management security controller (DMSC). The DMSC controls device management, boot sequence, reset, power management, and security. It also controls all isolation via on-chip firewalls, fulfilling access requests and managing secure authentication requests.  

    In addition, the DMSC stores securely all critical assets such as keys and configuration data to reduce the opportunity for attacks. The DMSC ensures that all secure resources are working in harmony and that a security hack in one part of the device doesn’t lead to the collapse of the entire SoC. The secure portion of the DMSC firmware is only available in binary form.

    The AM6x design supports an enhanced firewall architecture that permits dynamic access control to all SoC resources, such as memories, peripherals, and cores. The DMSC provides the ability to promote or demote firewall access to resources. DMSC resources are accessible through defined application programming interfaces (APIs).

    The AM6x cryptographic subsystem meets the latest cryptographic requirements and includes hardware support for: 

  • The National Institute of Standards and Technology’s (NIST) Elliptic Curve Digital Signature Algorithm (ECDSA)
  • Deterministic random bit generator (DRBG)
  • Advanced Encryption Standard (AES)
  • Triple Data Encryption Algorithm (3DES)
  • Secure Hash Algorithm-1 and -2 (SHA-1, SHA-2)
  • Message Digest 5 (MD5)
  • Enhanced control available with the AM6x device allows for security-aware debugging. For example, the SoC provides the ability to lock the secure world while debugging in the public world. Other security features include run-time security and secure boot with programmable keys.


    The AM6x includes multiple blocks to enhance connectivity. There are three next-generation industrial communication systems (ICSSs), each containing four programmable real-time units (PRUs) running at up to 250 MHz. PRUs are reduced instruction-set computer (RISC) cores with no cache and no pipeline to enable deterministic, single-cycle processing. Each PRU-ICSSG has two Reduced Gigabit Media Independent Interface (RGMII)- based Ethernet ports to support TSN up to gigabit speeds, as well as other popular industrial Ethernet protocols. An additional Ethernet media access controller (MAC) supports RGMII. A single AM6x can communicate up to seven Ethernet ports concurrently.

    Sitara Example: Servo-Motor Drive

    Servo motors have been a staple in manufacturing and automation for many years. Now, though, with the rise of Industry 4.0 and smart factories, demand is increasing for smarter servo drives that can control a greater number of axes.

    Historically, high-end microcontrollers and large field-programmable gate arrays (FPGAs) performed the low-level control algorithms. They also included peripherals to drive the output block and read motor feedback.

    However, the requirements for a servo-drive controller are rapidly changing. To reduce overall size and cost, control boards are increasingly including general-purpose programmable-logic-controller (PLC) functionality and networked communications, in addition to Industry 4.0 requirements such as functional safety and predictive maintenance.

    A servo-motor control system typically contains several control-loop layers arranged in a cascade; each loop has its own real-time processing requirements. Figure 6 shows a typical cascaded control topology.

    6. A standard servo-motor system with three cascaded loops. (Image Source: TI “Utilizing Sitara processors for Industry 4.0 servo drives” PDF, p. 3)

    The inner torque/current loop uses a field-oriented-control (FOC) algorithm to drive the phase windings via three half-bridge power blocks. This loop is the tightest, with the highest update rate; upstream are the speed loop, the position loop, and a higher-level motion-control loop. Each loop runs at a multiple of the loop before it and provides the input reference to its downstream loop.

    The blocks in Figure 6 lend themselves well to logical partitioning across cores within a heterogeneous processor, or between a processor and microcontroller. Spreading the various loops among the different cores in a multicore processor maximizes the processing bandwidth dedicated to each loop. When a processor core receives its control-loop input data, it can run the algorithm to completion as quickly as possible, provide the reference value for the downstream loop, and then continue providing other services until the next set of input data is ready.

    Processors with higher raw performance can finish the control processing faster and have more bandwidth available to provide additional services and features. Fast processing is especially crucial when cycle times approach 31.25 µs in a 32-kHz control loop or when inputs from multiple axes must be processed practically simultaneously.

    7. Several TI processing solutions are suitable for servo-drive applications, including Sitara, Hercules, and C2000 controllers. (Source: TI “Utilizing Sitara processors for Industry 4.0 servo drives” PDF, p. 6, fig. 5)

    Several TI processors can support the servo-drive application (Fig. 7), but the AM65x also will accommodate Industry 4.0 functional safety, security, networking, and communication requirements.  Figure 8 shows a Sitara AM65x processor configured for a servo-processing application. The servo loops are split between two ARM cores: one Cortex R5F in the MCUSS handles the fast current loop and a Cortex-A53 processes the speed and position loops.

    8. A servo processor with integrated Industry 4.0 features using the AM65x. (Source: TI “Utilizing Sitara processors for Industry 4.0 servo drives” PDF, p. 6, fig. 6)

    The other Cortex R5F is devoted to functional safety, while the other Cortex A53 manages communication and other Industry 4.0 services. The ICSSG0 block implements several gigabit industrial Ethernet ports. The remaining ICSSG blocks provide the PWM drive signals to the servo-motor power board; read the digitized voltage and current signals from the stator phases; handle fault and diagnostic inputs; and read the outputs from the precision encoders.

     Sponsored Resources: 

    Libre Wireless Technologies Revolutionary MAVID Embedded Wireless Audio/Voice/IoT Device and Software Now Amazon Alexa Built-in | real questions and Pass4sure dumps

    Libre Wireless Technologies, Inc. a leading embedded Wireless Voice/AI solutions provider, today announced “MAVID,” its super compact, ultra-low power mic-to-cloud platform, now supports the Alexa Voice Service (AVS). This breakthrough platform incorporates a complete hardware and software solution for embedded voice, IoT, audio and wireless connectivity, and now features integrated AVS. In addition to bringing great value to existing voice-enabled products, this platform will enable OEM’s and ODM’s to create entirely new applications not previously possible, such as pocket-sized battery-powered devices, unique portable and even wearable products for next generation AI and voice service products.

    MAVID measures only 13.5mm x 13.5mm and provides performance optimized dual band WiFi, Bluetooth audio/BLE and extensive host MCU capabilities incorporating a feature rich STM32 microcontroller from STMicroelectronics. This industry-leading low-power voice/AI solution is enabled with the STM32Cube.AI Neural-Network developer toolboxand will be continually expanding features through this important STM32 portfolio and ecosystem into the future.

    “We appreciate their strong relationship with Libre and that this collaboration has yielded such a unique voice/AI device in this explosive new market,” said Miguel Castro, Artificial Intelligence and Machine Learning Marketing Manager, STMicroelectronics. “We are excited that the MAVID platform is now approved and ready for market and that engaged customers are already designing break-through new products and that the strong demand pipeline can now be accelerated together with Libre.”

    MAVID’s multiprotocol connectivity comes with best-in-class 2.4/5Ghz dual-band 802.11ac WiFi, BT 4.1 with audio and BLE interfaces, concurrent WiFi/BT operation and protocol support along with RF/Antenna coexistence. It also features a highly efficient RTOS-based OS with minimum memory footprint and rapid response; 1/2/3 mic far field voice options with full Acoustic Echo Cancellation for ASR and Voice communications; Beam Forming; regional Wake Word recognition; ultra-low power Wake-on-voice features; and embedded RAM and Flash memory. This extensive hardware integration into a single device is incredibly unique and now features support for Alexa, all running on Libre’s very fast and power efficient Real-Time Operating System.

    “We are very proud of having worked on MAVID and delivering this revolutionary voice/AI technology product to market. MAVID offers so much unique and differentiating value to their customers, especially at this time when Brand/OEM customers are looking for key differentiation and the ability to position their products along side the first party products,” says Jordan Watters, Chief Executive Officer at Libre Wireless Technologies. “We are very excited by the overwhelming market response to MAVID and the new voice enabled products being designed based on this unique technology. They look forward to more product announcements in the coming weeks and months.”

    The first MAVID-based product is for Alexa and will launch in the India market, with several products in the certification pipeline for the US and EU markets with launches beginning in Q1 2019.

    About Libre Wireless Technologies, Inc.

    Libre Wireless Technologies has extensive expertise in developing WiFi/Wireless technologies for IoT, media streaming, voice interface/control and AI applications. Libre delivers comprehensive hardware and software SDK platforms that are scalable across ecosystems, features, power and price. Libre offers a range of approved and certified electronic modules along with RF/antenna design solutions and extensive software that manages virtually all aspects of system, voice and connectivity features. The Libre team has deep WiFi/BT technology, IoT and A/V system design experience combined with world wide sales, technical support and design partnerships. The Libre platforms incorporate unique media streaming technology, scalable mic-to-cloud voice processing modules, broad mobile platform ecosystem support, seamless interoperability, scalable price/performance solutions and flexible WiFi/Bluetooth/Zigbee/DECT options. Optimized for performance, power, size and cost, the Libre Wireless solutions provide ODM’s and CE Brand customers with the most complete, flexible and ecosystem leading technology available.

    View source version on

    SOURCE: Libre Wireless Technologies, Inc.

    Jordan Watters - Chief Executive Officer, FounderPhone:

    Copyright Business Wire 2019

    Libre Wireless Technologies Announces New Financing To Fuel Growth Of Their Industry Leading Embedded Wireless Audio/Voice/IoT/AI Technologies | real questions and Pass4sure dumps

    PALO ALTO, Calif.–(BUSINESS WIRE)–February 4, 2019–

    Libre Wireless Technologies, Inc. a leading embedded Wireless Voice/AI solutions provider, today announced the closing of new financing that will fund the company’s growing product line, support expanding customer engagements and operational growth. This capital infusion will be especially targeted for the new “MAVID” device (Multiprotocol, Audio, Voice, IoT Device) and software SDK, and now this super compact, ultra-low power mic-to-cloud platform supports the Alexa Voice Service (AVS).

    Along with the financing, Libre is restructuring under the leadership of Jordan Watters, newly named CEO. The changes are oriented around fast development execution and closer customer support with a focus on local presence, scalability and time-to-market in the traditional CE segments as well as increased focus on broader IoT applications where connectivity, security and cloud technology all come together.

    “We are excited to be a part of the Libre family and about these changes and the improvements they will deliver” says CEO Harry Wang at Linear Capital. “The opportunity in this space is tremendous and they believe Libre’s technology and solutions can play a unique role in the future of voice and AI in markets world wide.”

    “The fruitful cooperation between Libre Wireless and DSP Group has already resulted in the introduction of innovative VUI solutions, and they are looking forward to enhance their partnership in delivering best in class solutions to their customers,” says Yosi Brosh, CVP SmartVoice in DSP Group. “We are especially excited about the innovative new Libre MAVID voice platform featuring DSP Group voice technology delivering the smallest form-factor and lowest power consumption in the industry.”

    “Voice, connectivity and intelligent devices are at the center of today’s technology revolution, and Libre is in the center of that storm,” says Jordan Watters, Chief Executive Officer at Libre Wireless Technologies. “Our new structure and capital will enable faster execution and improved resources to ensure better customer support and confidence. With industry leading unique embedded voice hardware and software solutions, strong and committed financing partners, compelling tier 1 technology partnerships and lead position with ecosystem giants, Libre is positioned for strong growth and an exciting future.”

    About Libre Wireless Technologies, Inc.

    Libre Wireless Technologies has extensive expertise in developing WiFi/Wireless technologies for IoT, media streaming, voice interface/control and AI applications. Libre delivers comprehensive hardware and software SDK platforms that are scalable across ecosystems, features, power and price. Libre offers a range of approved and certified electronic modules along with RF/antenna design solutions and extensive software that manages virtually all aspects of system, voice and connectivity features. The Libre team has deep WiFi/BT technology, IoT and A/V system design experience combined with world wide sales, technical support and design partnerships. The Libre platforms incorporate unique media streaming technology, scalable mic-to-cloud voice processing modules, broad mobile platform ecosystem support, seamless interoperability, scalable price/performance solutions and flexible WiFi/Bluetooth/Zigbee/DECT options. Optimized for performance, power, size and cost, the Libre Wireless solutions provide ODM’s and CE Brand customers with the most complete, flexible and ecosystem leading technology available.

    Jordan Watters – Chief Executive Officer, FounderPhone:

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